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4th Dresden Nanoanalysis Symposium "Materials Modeling and Characterization"

15.06.2016 (Wednesday) , 09:00 - 15:30
Fraunhofer Campus Dresden, FEP Lecture Hall , Winterbergstraße , 01277 Dresden

Welcome (9:00 am – 9:15 am)
Ehrenfried Zschech, Fraunhofer IKTS Dresden and Technische Universität Dresden, Germany

Session 1 (9:15 am – 10:45 am)
“From data to knowledge – “functional nano-imaging” workflows for industrial applications”
Jens Greiser, CTO and VP, FEI Inc., Eindhoven, Netherlands

"3D Nano-characterization using electron tomography from acquisition to quantitative analysis"
Tony Printemps, CEA, LETI, Grenoble, France

“Quantitative atomic scale inelastic STEM imaging”
Gerald Kothleitner, Graz University of Technology, Austria

“Multilayer Laue lenses – Novel optics for nano X-ray tomography in a wide range of photon energy”
Jürgen Gluch, Fraunhofer IKTS, Dresden, Germany

Session 2 (11:15 am – 12:45 pm)
"Modelling of thermal residual stresses and micromechanical properties of metal-ceramic composites"
Michal Basista, IPPT Warsaw, Poland

“Characterization and modelling of thermo-mechanical degradation in power electronic modules”
Olaf Wittler, Fraunhofer IZM, Berlin, Germany

"Collisional computer simulation of ion processing and ion-based analysis of nanostructures"
Wolfhard Möller, Helmholtz Zentrum Dresden-Rossendorf, Dresden, Germany

"Properties and applications of novel visible light photocatalists"
George Kiriakid, Forth Center Crete, Greece

Session 3 (1:45 pm – 3:15 pm)
“Extraction of mechanical and thermal properties of thin films and structures using nanoindentation combined with FEM”
Ingrid de Wolf, IMEC, Leuven, Belgium

“High-resolution mechanical studies of glass fibre composites”
Jaroslaw Lukes, Hysitron, Praha, Czech Republic

“Mechanical characterization of ultra-thin coatings”
Thomas Chudoba, ASMEC GmbH, Radeberg, Germany

"The challenge of measuring strain in FDSOI device structures - HRXRD as a potential method of resolution”
Holm Geisler, GLOBALFOUNDRIES, Dresden, Germany

Closing remarks (3:15 pm – 3:30 pm)
Ehrenfried Zschech, Fraunhofer IKTS Dresden and Technische Universität Dresden, Germany

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