A major bottleneck, however, to allow these devices to hit the market, is the packaging of the sensitive microstructures to a rugged outer casing that makes handling possible and allow them to withstand even harsh environments. On this path, many unexpected challenges are encountered when interfacing the system structure to the outer world.
The focus of the 22nd Chemnitzer Seminar is to discuss and show paths to solve these challenges.
Systems Integration Technologies
23.06.2015 (Tuesday) - 24.06.2015 (Wednesday)
, 13:00 - 13:00
Technologie-Campus 3 09126 Chemnitz