Motivation & Goal

photo microchip

Information processing is currently dominated by complementary metal oxide semiconductor (CMOS) technology. Since the 1960s the advancements in electronics due to scaling of integration densities along Moore’s law have established a general expectation for very short innovation cycles with ever-new application possibilities. Indeed, the huge advancement of electronics over the past decades has been the driving force for innovation in various application fields and has significantly shaped the world we live in today.

As CMOS technology is reaching atomic boundaries, it increasingly fails to deal with the negative impacts on device behavior due to shrinkage (short channel effects, leakage, etc.), and Moore’s law is projected to end. Thus, it is accepted that long-term innovation in electronics cannot be based solely on higher planar integration densities. Instead, new ways must be found to address current and future challenges of electronic information processing systems: physical size, speed, energy efficiency, new functionality, self-assembly/-organization, adaptivity, resilience, cost.

Currently, there is still room for improvement in CMOS technology and industry roadmaps reach out to 2022. The past decade has seen significant advances in new materials, which have led to many promising discoveries. While material research needs to continue, some discoveries have now reached a point that warrants exploring device fabrication, circuits, and information processing systems for potential applications. As CMOS scaling is projected to end soon after 2020, industry will stop being preoccupied with advancing CMOS and will eagerly look out for new ideas. Given these two developments, we believe that university-based research now has a unique opportunity to integrate discoveries on new materials and technological innovations with the potential for advancing electronic information processing beyond 2020.

Specifically, it is the vision of the Center for Advancing Electronics Dresden (cfaed) that future CMOS technology will be complemented with new technologies (augmented CMOS), resulting in heterogeneous architectures to form highly efficient information processing environments.