cfaed Publications
Wafer-level integration technology for multi emitter high power fiber coupled lasers
Reference
Lukas Lorenz, Ralf Rieske, Krzysztof Nieweglowski, Klaus-Jürgen Wolter, Karlheinz Bock, "Wafer-level integration technology for multi emitter high power fiber coupled lasers" , Proceedings of the IMAPS European Microelectronics Packaging Conference (EMPC), Sep 2015.
Bibtex
@InProceedings{ auto-key*df,
author = {Lukas Lorenz and Ralf Rieske and Krzysztof Nieweglowski and Klaus-Jürgen Wolter and Karlheinz Bock},
title = {Wafer-level integration technology for multi emitter high power fiber coupled lasers},
booktitle = {Proceedings of the IMAPS European Microelectronics Packaging Conference (EMPC)},
month = sep,
year = {2015},
project = {A10},
annote = {IMAPS = International Microelectronics, Assembly and Packaging Society}
}
author = {Lukas Lorenz and Ralf Rieske and Krzysztof Nieweglowski and Klaus-Jürgen Wolter and Karlheinz Bock},
title = {Wafer-level integration technology for multi emitter high power fiber coupled lasers},
booktitle = {Proceedings of the IMAPS European Microelectronics Packaging Conference (EMPC)},
month = sep,
year = {2015},
project = {A10},
annote = {IMAPS = International Microelectronics, Assembly and Packaging Society}
}
Downloads
No Downloads available for this publication
Related Paths
Permalink
https://cfaed.tu-dresden.de/publications?pubId=1071