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Rounding of Negative Dry Film Resist by Diffusive Backside Exposure Creating Rounded Channels for Pneumatic Membrane Valves
Reference
Philipp Frank, Sebastian Haefner, Georgi Paschew, Andreas Richter, "Rounding of Negative Dry Film Resist by Diffusive Backside Exposure Creating Rounded Channels for Pneumatic Membrane Valves", In Micromachines, vol. 6, no. 11, pp. 1588–1596, 2015. [doi]
Abstract
Processing of dry film resist is an easy, low-cost, and fast way to fabricate microfluidic structures. Currently, common processes are limited to creating solely rectangular channels. However, it has shown that rounded channels are necessary to ensure proper closing of pneumatic membrane valves for microfluidic devices. Here, we introduce a modification to the standard lithography process, in order to create rounded channels for microfluidic structures. Therefore, a diffuser element was inserted into in the optical path between the light source and glass substrate, which is then exposed through the backside, hence altering the exposure to the dry resist spatially. Characterization of the process was carried out with different exposure times, features sizes, and substrate thickness. The process modification is almost effortless and can be integrated in any lithography process.
Bibtex
AUTHOR = {Frank, Philipp and Haefner, Sebastian and Paschew, Georgi and Richter, Andreas},
TITLE = {Rounding of Negative Dry Film Resist by Diffusive Backside Exposure Creating Rounded Channels for Pneumatic Membrane Valves},
JOURNAL = {Micromachines},
VOLUME = {6},
YEAR = {2015},
NUMBER = {11},
PAGES = {1588--1596},
URL = {http://www.mdpi.com/2072-666X/6/11/1442},
ISSN = {2072-666X},
ABSTRACT = {Processing of dry film resist is an easy, low-cost, and fast way to fabricate microfluidic structures. Currently, common processes are limited to creating solely rectangular channels. However, it has shown that rounded channels are necessary to ensure proper closing of pneumatic membrane valves for microfluidic devices. Here, we introduce a modification to the standard lithography process, in order to create rounded channels for microfluidic structures. Therefore, a diffuser element was inserted into in the optical path between the light source and glass substrate, which is then exposed through the backside, hence altering the exposure to the dry resist spatially. Characterization of the process was carried out with different exposure times, features sizes, and substrate thickness. The process modification is almost effortless and can be integrated in any lithography process.},
DOI = {10.3390/mi6111442}
}
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