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TEM Investigation of Time-Dependent Dielectric Breakdown Mechanisms in Cu/Low-k Interconnects
Reference
Zhongquan Liao, Martin Gall, Kong Boon Yeap, Christoph Sander, Andre Clausner, Uwe Muhle, Jurgen Gluch, Yvonne Standke, Rudiger Rosenkranz, Oliver Aubel, others, "TEM Investigation of Time-Dependent Dielectric Breakdown Mechanisms in Cu/Low-k Interconnects", IEEE, 2016.
Bibtex
@article{liao2016tem,
title={TEM Investigation of Time-Dependent Dielectric Breakdown Mechanisms in Cu/Low-k Interconnects},
author={Liao, Zhongquan and Gall, Martin and Yeap, Kong Boon and Sander, Christoph and Clausner, Andre and Muhle, Uwe and Gluch, Jurgen and Standke, Yvonne and Rosenkranz, Rudiger and Aubel, Oliver and others},
year={2016},
publisher={IEEE}
}
title={TEM Investigation of Time-Dependent Dielectric Breakdown Mechanisms in Cu/Low-k Interconnects},
author={Liao, Zhongquan and Gall, Martin and Yeap, Kong Boon and Sander, Christoph and Clausner, Andre and Muhle, Uwe and Gluch, Jurgen and Standke, Yvonne and Rosenkranz, Rudiger and Aubel, Oliver and others},
year={2016},
publisher={IEEE}
}
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