cfaed Publications
Thermal reflow of polymers for innovative and smart 3D structures: A review
Reference
Robert Kirchner, Helmut Schift, "Thermal reflow of polymers for innovative and smart 3D structures: A review", In Materials Science in Semiconductor Processing, Elsevier BV, vol. 92, pp. 58–72, Mar 2019. [doi]
Bibtex
@article{Kirchner_2019,
doi = {10.1016/j.mssp.2018.07.032},
url = {https://doi.org/10.1016%2Fj.mssp.2018.07.032},
year = 2019,
month = {mar},
publisher = {Elsevier {BV}},
volume = {92},
pages = {58--72},
author = {Robert Kirchner and Helmut Schift},
title = {Thermal reflow of polymers for innovative and smart 3D structures: A review},
journal = {Materials Science in Semiconductor Processing}
}
doi = {10.1016/j.mssp.2018.07.032},
url = {https://doi.org/10.1016%2Fj.mssp.2018.07.032},
year = 2019,
month = {mar},
publisher = {Elsevier {BV}},
volume = {92},
pages = {58--72},
author = {Robert Kirchner and Helmut Schift},
title = {Thermal reflow of polymers for innovative and smart 3D structures: A review},
journal = {Materials Science in Semiconductor Processing}
}
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