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In-situ SEM micromechanical experiments on Dual Damascene Copper test structures for investigation of interfacial properties of copper interconnects
Reference
Wieland Heyn, Hanno Melzner, Klaus Goller, Sergey Ananiev, Andre Clausner, Johannes Zechner, Ehrenfried Zschech, "In-situ SEM micromechanical experiments on Dual Damascene Copper test structures for investigation of interfacial properties of copper interconnects", In Proceeding: 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), IEEE, Sep 2021. [doi]
Bibtex
@inproceedings{Heyn_2021,
doi = {10.1109/ipfa53173.2021.9617276},
url = {https://doi.org/10.1109%2Fipfa53173.2021.9617276},
year = 2021,
month = {sep},
publisher = ,
author = {Wieland Heyn and Hanno Melzner and Klaus Goller and Sergey Ananiev and Andre Clausner and Johannes Zechner and Ehrenfried Zschech},
title = {In-situ {SEM} micromechanical experiments on Dual Damascene Copper test structures for investigation of interfacial properties of copper interconnects},
booktitle = {2021 {IEEE} International Symposium on the Physical and Failure Analysis of Integrated Circuits ({IPFA})}
}
doi = {10.1109/ipfa53173.2021.9617276},
url = {https://doi.org/10.1109%2Fipfa53173.2021.9617276},
year = 2021,
month = {sep},
publisher = ,
author = {Wieland Heyn and Hanno Melzner and Klaus Goller and Sergey Ananiev and Andre Clausner and Johannes Zechner and Ehrenfried Zschech},
title = {In-situ {SEM} micromechanical experiments on Dual Damascene Copper test structures for investigation of interfacial properties of copper interconnects},
booktitle = {2021 {IEEE} International Symposium on the Physical and Failure Analysis of Integrated Circuits ({IPFA})}
}
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