cfaed Publications

Multi-scale X-ray tomography for process and quality control in 3D TSV packaging

Reference

Ehrenfried Zschech, Sven Niese, Markus Löffler, Jürgen Wolf, "Multi-scale X-ray tomography for process and quality control in 3D TSV packaging" , In Proceeding: International Symposium on Microelectronics, vol. 2014, no. 1, pp. 000184–000187, 2014.

Bibtex

@inproceedings{zschech2014multi,
title={Multi-scale X-ray tomography for process and quality control in 3D TSV packaging},
author={Zschech, Ehrenfried and Niese, Sven and L{\"o}ffler, Markus and Wolf, J{\"u}rgen},
booktitle={International Symposium on Microelectronics},
volume={2014},
number={1},
pages={000184--000187},
year={2014},
organization={International Microelectronics Assembly and Packaging Society}
}

Downloads

No Downloads available for this publication

Related Paths

DCN

Permalink

https://cfaed.tu-dresden.de/publications?pubId=694


Go back to publications list