cfaed Publications
Multi-scale X-ray tomography for process and quality control in 3D TSV packaging
Reference
Ehrenfried Zschech, Sven Niese, Markus Löffler, Jürgen Wolf, "Multi-scale X-ray tomography for process and quality control in 3D TSV packaging", In Proceeding: International Symposium on Microelectronics, vol. 2014, no. 1, pp. 000184–000187, 2014.
Bibtex
@inproceedings{zschech2014multi,
title={Multi-scale X-ray tomography for process and quality control in 3D TSV packaging},
author={Zschech, Ehrenfried and Niese, Sven and L{\"o}ffler, Markus and Wolf, J{\"u}rgen},
booktitle={International Symposium on Microelectronics},
volume={2014},
number={1},
pages={000184--000187},
year={2014},
organization={International Microelectronics Assembly and Packaging Society}
}
title={Multi-scale X-ray tomography for process and quality control in 3D TSV packaging},
author={Zschech, Ehrenfried and Niese, Sven and L{\"o}ffler, Markus and Wolf, J{\"u}rgen},
booktitle={International Symposium on Microelectronics},
volume={2014},
number={1},
pages={000184--000187},
year={2014},
organization={International Microelectronics Assembly and Packaging Society}
}
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