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Back-end-of-line compatible contact materials for carbon nanotube based interconnects
Reference
Holger Fiedler, Marius Toader, Sascha Hermann, Michael Rennau, Raul D. Rodriguez, Evgeniya Sheremet, Michael Hietschold, Dietrich R.T. Zahn, Stefan E. Schulz, Thomas Gessner, "Back-end-of-line compatible contact materials for carbon nanotube based interconnects", In Microelectronic Engineering, Elsevier BV, vol. 137, pp. 130–134, Apr 2015. [doi]
Bibtex
@article{Fiedler_2015,
title={Back-end-of-line compatible contact materials for carbon nanotube based interconnects},
volume={137},
ISSN={0167-9317},
url={http://dx.doi.org/10.1016/j.mee.2014.11.004},
DOI={10.1016/j.mee.2014.11.004},
journal={Microelectronic Engineering},
publisher={Elsevier BV},
author={Fiedler, Holger and Toader, Marius and Hermann, Sascha and Rennau, Michael and Rodriguez, Raul D. and Sheremet, Evgeniya and Hietschold, Michael and Zahn, Dietrich R.T. and Schulz, Stefan E. and Gessner, Thomas},
year={2015},
month={Apr},
pages={130–134}
}
title={Back-end-of-line compatible contact materials for carbon nanotube based interconnects},
volume={137},
ISSN={0167-9317},
url={http://dx.doi.org/10.1016/j.mee.2014.11.004},
DOI={10.1016/j.mee.2014.11.004},
journal={Microelectronic Engineering},
publisher={Elsevier BV},
author={Fiedler, Holger and Toader, Marius and Hermann, Sascha and Rennau, Michael and Rodriguez, Raul D. and Sheremet, Evgeniya and Hietschold, Michael and Zahn, Dietrich R.T. and Schulz, Stefan E. and Gessner, Thomas},
year={2015},
month={Apr},
pages={130–134}
}
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