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Copper oxide atomic layer deposition on thermally pretreated multi-walled carbon nanotubes for interconnect applications

Reference

Marcel Melzer, Thomas Waechtler, Steve Müller, Holger Fiedler, Sascha Hermann, Raul D. Rodriguez, Alexander Villabona, Andrea Sendzik, Robert Mothes, Stefan E. Schulz, et al., "Copper oxide atomic layer deposition on thermally pretreated multi-walled carbon nanotubes for interconnect applications" , In Microelectronic Engineering, Elsevier BV, vol. 107, pp. 223–228, Jul 2013. [doi]

Bibtex

@article{Melzer_2013,
title={Copper oxide atomic layer deposition on thermally pretreated multi-walled carbon nanotubes for interconnect applications},
volume={107},
ISSN={0167-9317},
url={http://dx.doi.org/10.1016/j.mee.2012.10.026},
DOI={10.1016/j.mee.2012.10.026},
journal={Microelectronic Engineering},
publisher={Elsevier BV},
author={Melzer, Marcel and Waechtler, Thomas and Müller, Steve and Fiedler, Holger and Hermann, Sascha and Rodriguez, Raul D. and Villabona, Alexander and Sendzik, Andrea and Mothes, Robert and Schulz, Stefan E. and et al.},
year={2013},
month={Jul},
pages={223–228}
}

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