cfaed Publications

@Article{hu_dnt25,
author = {Xiaobo Sharon Hu and Ming-Yen Lee and Mengyuan Li and João Paulo Cardoso de Lima and Liu Liu and Zhenhua Zhu and Jeronimo Castrillon and Michael Niemier and Yu Wang},
journal = {IEEE Design \& Test, Special Issue on the 20 years of the IEEE CEDA},
title = {Cross-Layer Design and Design Automation for In-Memory Computing based on Non-Volatile Memory Technologies},
doi = {10.1109/MDAT.2025.3603495},
url = {https://ieeexplore.ieee.org/document/11142851},
month = aug,
numpages = {11},
publisher = {IEEE},
year = {2025},
abstract = {Data transfer between processors and memory remains a critical bottleneck in improving application performance on traditional computing hardware, particularly for data-intensive workloads such as machine learning, bioinformatics, and security applications. In-memory computing (IMC), a paradigm where a substantial portion of data processing occurs directly within memory, has emerged as a promising solution to mitigate this bottleneck. The advancement of emerging non-volatile memory (NVM) technologies has further accelerated the development of IMC hardware fabrics. However, harnessing the full potential of IMC requires a cross-layer design approach that spans memory technologies, circuits, architectures, and systems. Essential cross-layer tools --including modeling and simulation, data partitioning and mapping, and operation scheduling--play a pivotal role in designing efficient IMC-based hardware. This article reviews key advancements in simulation and design tools for IMC fabrics, with a focus on NVM-based crossbar arrays and content-addressable memories, while highlighting the necessity of cross-layer collaboration. Additionally, we discuss current challenges and emerging opportunities in the field.},
}